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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
Rev. 1 -- 5 August 2010 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in common cathode configuration with an integrated guard ring for stress protection, encapsulated in a SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.
1.2 Features and benefits
Average forward current: IF(AV) 2 A Reverse voltage: VR 20 V Low forward voltage Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity Leadless small SMD plastic package with medium power capability AEC-Q101 qualified
1.3 Applications
Low voltage rectification High efficiency DC-to-DC conversion Switch Mode Power Supply (SMPS) Reverse polarity protection Low power consumption applications Battery chargers for mobile equipment
1.4 Quick reference data
Table 1. Quick reference data Tj = 25 C unless otherwise specified. Symbol Per diode IF(AV) average forward current square wave; = 0.5; f = 20 kHz Tamb 80 C Tsp 140 C VR VF IR
[1]
[1]
Parameter
Conditions
Min
Typ
Max
Unit
-
385 380
2 2 20 420 1000
A A V mV A
reverse voltage forward voltage reverse current IF = 2 A VR = 20 V
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
NXP Semiconductors
PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
2. Pinning information
Table 2. Pin 1 2 3 Pinning Description anode diode 1 anode diode 2 common cathode
3 3
Simplified outline
Graphic symbol
1
2
1
2
006aaa438
Transparent top view
3. Ordering information
Table 3. Ordering information Package Name Description Version Type number
PMEG2020CPA HUSON3 plastic thermal enhanced ultra thin small outline package; SOT1061 no leads; three terminals; body 2 x 2 x 0.65 mm
4. Marking
Table 4. Marking codes Marking code AL Type number PMEG2020CPA
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode VR IF(AV) reverse voltage average forward current Tj 25 C square wave; = 0.5; f = 20 kHz Tamb 80 C Tsp 140 C IFRM IFSM repetitive peak forward current non-repetitive peak forward current tp 1 ms; 0.25 square wave; tp = 8 ms
[2] [1]
Parameter
Conditions
Min -
Max 20
Unit V
-
2 2 7 9
A A A A
PMEG2020CPA
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Product data sheet
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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
Table 5. Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Ptot Parameter total power dissipation Conditions Tamb 25 C
[3][4] [3][5] [1][3]
Min -55 -65
Max 500 960 1800 150 +150 +150
Unit mW mW mW C C C
Per device, one diode loaded
Tj Tamb Tstg
[1] [2] [3] [4] [5]
junction temperature ambient temperature storage temperature
Device mounted on a ceramic PCB, Al2O3, standard footprint. Tj = 25 C prior to surge. Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air
[1][2] [3] [4] [5]
Min
Typ
Max
Unit
Per device, one diode loaded 250 130 70 12 K/W K/W K/W K/W
Rth(j-sp)
[1] [2] [3] [4] [5] [6]
thermal resistance from junction to solder point
[6]
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. Reflow soldering is the only recommended soldering method. Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint. Soldering point of cathode tab.
PMEG2020CPA
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
103 Zth(j-a) (K/W) 102 duty cycle = 1 0.5 0.25 0.1 0.05 10 0.02 0.01 0 1 10-3 10-2 10-1 102 0.33 0.2 0.75
006aac403
1
10
103 tp (s)
FR4 PCB, standard footprint
Fig 1.
103 Zth(j-a) (K/W)
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac404
duty cycle = 102 1 0.5 0.33 0.25 0.1 0.2 0.05 0.75
10
0 1 10-3
0.02 0.01 10-2 10-1 102 tp (s) 103
1
10
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG2020CPA
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Product data sheet
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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
102
006aac405
duty cycle = 1 0.75
Zth(j-a) (K/W)
0.5 0.33 0.25 0.2 0.05
10
0.1
0
0.02 0.01
1 10-3
10-2
10-1
1
10
102 tp (s)
103
Ceramic PCB, Al2O3, standard footprint
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
7. Characteristics
Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol Per diode VF forward voltage IF = 100 mA IF = 1 A IF = 2 A IR Cd reverse current diode capacitance VR = 10 V VR = 20 V f = 1 MHz VR = 1 V VR = 10 V trr
[1]
Parameter
Conditions
Min [1]
Typ 220 320 385 160 380 175 65 55
Max 360 420 1000 -
Unit mV mV mV A A pF pF ns
reverse recovery time
-
When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA.
PMEG2020CPA
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
5 of 15
NXP Semiconductors
PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
10 IF (A) 1
(1) (2)
006aac406
1 IR (A) 10-1 10-2
006aac407
(1)
(2)
10-1
(3)
(4)
(5)
10-3
(3)
10-2
10-4 10-5
10-3
10-6 10-7 0.2 0.4 VF (V) 0.6 0 4 8
(4)
10-4 0.0
12
16 VR (V)
20
(1) Tj = 150 C (2) Tj = 125 C (3) Tj = 85 C (4) Tj = 25 C (5) Tj = -40 C
(1) Tj = 125 C (2) Tj = 85 C (3) Tj = 25 C (4) Tj = -40 C
Fig 4.
Forward current as a function of forward voltage; typical values
350 Cd (pF) 300 250 200 150 100 50 0 0 5 10
Fig 5.
Reverse current as a function of reverse voltage; typical values
006aac408
15 VR (V)
20
f = 1 MHz; Tamb = 25 C
Fig 6.
Diode capacitance as a function of reverse voltage; typical values
PMEG2020CPA
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
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NXP Semiconductors
PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
1.2 PF(AV) (W)
(2)
006aac409
4.0 PR(AV) (W) 3.0
006aac410
(4) (3)
0.8
(1)
2.0
(1) (2) (3)
0.4 1.0
(4)
0.0 0.0
1.0
2.0 IF(AV) (A)
3.0
0.0 0.0
6.0
12.0 VR (V)
18.0
Tj = 150 C (1) = 0.1 (2) = 0.2 (3) = 0.5 (4) = 1
Tj = 125 C (1) = 1 (2) = 0.9 (3) = 0.8 (4) = 0.5
Fig 7.
Average forward power dissipation as a function of average forward current; typical values
3.0
006aac411
Fig 8.
Average reverse power dissipation as a function of reverse voltage; typical values
3.0
(1)
006aac412
IF(AV) (A) 2.0
(1)
IF(AV) (A)
(2)
2.0
(2)
(3) (3) (4)
1.0
(4)
1.0
0.0 0 25 50 75 100 125 150 175 Tamb (C)
0.0 0 25 50 75 100 125 150 175 Tamb (C)
FR4 PCB, standard footprint Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
FR4 PCB, mounting pad for cathode 1 cm2 Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
Fig 9.
Average forward current as a function of ambient temperature; typical values
Fig 10. Average forward current as a function of ambient temperature; typical values
(c) NXP B.V. 2010. All rights reserved.
PMEG2020CPA
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 1 -- 5 August 2010
7 of 15
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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
3.0
(1)
006aac413
3.0
(1)
006aac414
IF(AV) (A)
(2)
IF(AV) (A)
(2)
2.0
2.0
(3) (4)
(3) (4)
1.0
1.0
0.0 0 25 50 75 100 125 150 175 Tamb (C)
0.0 0 25 50 75 100 125 150 175 Tsp (C)
Ceramic PCB, Al2O3, standard footprint Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
Tj = 150 C (1) = 1; DC (2) = 0.5; f = 20 kHz (3) = 0.2; f = 20 kHz (4) = 0.1; f = 20 kHz
Fig 11. Average forward current as a function of ambient temperature; typical values
Fig 12. Average forward current as a function of solder point temperature; typical values
PMEG2020CPA
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
8 of 15
NXP Semiconductors
PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
8. Test information
tr D.U.T. RS = 50 V = VR + IF x RS IF SAMPLING OSCILLOSCOPE Ri = 50 VR
mga881
tp t
10 % + IF trr t
90 % input signal output signal
(1)
(1) IR = 1 mA
Fig 13. Reverse recovery time test circuit and waveforms
P t2 t1
duty cycle =
t1 t2
t
006aaa812
Fig 14. Duty cycle definition
The current ratings for the typical waveforms as shown in Figure 9, 10, 11 and 12 are calculated according to the equations: I F ( AV ) = I M x with IM defined as peak current, I RMS = I F ( AV ) at DC, and I RMS = I M x with IRMS defined as RMS current.
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
PMEG2020CPA
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
9 of 15
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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
9. Package outline
1.3 0.35 0.25 1.05 0.95 1 2 0.45 0.35 2.1 1.9 0.65 max
1.1 0.9 0.3 0.2 3 1.6 1.4 2.1 1.9
Dimensions in mm
09-11-12
Fig 15. Package outline SOT1061
10. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMEG2020CPA
[1]
Package SOT1061
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115
For further information and the availability of packing methods, see Section 14.
PMEG2020CPA
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
10 of 15
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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
11. Soldering
2.1 1.3 0.5 (2x) 0.4 (2x)
0.5 (2x)
0.6 (2x)
1.05 2.3 0.6 0.55 0.25 1.1 1.2
0.25
0.25
0.4 0.5 1.6 1.7 solder paste = solder lands solder resist occupied area Dimensions in mm
sot1061_fr
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering footprint SOT1061
PMEG2020CPA
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(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
11 of 15
NXP Semiconductors
PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
12. Revision history
Table 9. Revision history Release date 20100805 Data sheet status Product data sheet Change notice Supersedes Document ID PMEG2020CPA v.1
PMEG2020CPA
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
12 of 15
NXP Semiconductors
PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
(c) NXP B.V. 2010. All rights reserved.
13.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
PMEG2020CPA
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Product data sheet
Rev. 1 -- 5 August 2010
13 of 15
NXP Semiconductors
PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PMEG2020CPA
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 1 -- 5 August 2010
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PMEG2020CPA
2 A low VF dual MEGA Schottky barrier rectifier
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 August 2010 Document identifier: PMEG2020CPA

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